Effects of voids on thermal-mechanical reliability of lead-free solder joints

Effects of voids on thermal-mechanical reliability of lead-free solder joints

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Reliability of electronic packages has become a major issue, particularly in systems used in electrical or hybrid cars where Incense severe operating conditions must be met.Many studies have shown that solder interconnects are critical elements baby toys since many failure mechanisms originate from their typical response under thermal cycles.In this study, effects of voids in solder interconnects on the electronic assembly lifetime are estimated based on finite element simulations.